A baking of the components is necessary if the component bodies have absorbed to much moisture. With this moistness the components can burst during the soldering (pop-corn effect). The moistness is being extracted from the component body during the baking in a soft way.
After the baking the components are vacuum-packed within 4 hours with desiccants and a humidity indicator card so that they can absorb no more moisture.
If not demanded otherwise by the customer we dry the components 24 hours with 125°C according to JEDEC J-STD-033.
The minimum durability and the MS-level of the components are given on the vacuum-package.
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