NEW +++ DIE taping

From now on we offer the service of taping of bare-dies, CSP`s, and so on directly from wafer in carrier tape.

- component dimensions from
  0,28 to 30 mm
- flip chip
- wafermapping or ink sorting
- wafer from 4" up to 8"

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Date of issue 2016

More than 1000 enterprises from the component manufacturer up to the consumer trust in the special knowledge of the Reel Company GmbH since years.