DIE taping

More and more bare DIE’s are taped and reeled directly. Therefore we offer this automatic taping & reeling service of Bare Dies,
CSP’s,  etc. direct from Wafer to SMD carrier tape.

- component dimensions from  0,28 to 8 mm
- flip chip
- wafermapping or ink sorting
- wafer from 4" up to 12"

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More than 1000 enterprises from the component manufacturer up to the consumer trust in the special knowledge of the Reel Company GmbH since years.