Component baking
A baking of the components is necessary if the component bodies have
absorbed to much moisture.
With this moistness the components can burst during the soldering (pop-corn
effect).
The moistness is being extracted from the component body during the baking
in a soft way.
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After the baking the components are vacuum-packed within 4 hours with
desiccants and a humidity indicator card so that they can absorb no more
moisture.
If not demanded otherwise by the customer we dry the components 24 hours
with 125°C according to JEDEC J-STD-033.
The minimum durability and the MS-level of the components are given on
the vacuum-package.
Click here to see a film about component drying [376kb]
Please contact us.