NEW +++ DIE taping
From now on we offer the service of taping of bare-dies, CSP`s, and so
on directly from wafer in carrier tape.
- component dimensions from
0,28 to 30 mm
- flip chip
- wafermapping or ink sorting
- wafer from 4" up to 8"
Please contact us.
Click
here to see a film about DIE taping [1,15 MB]
Reel Company GmbH - Am Reiterzentrum 4 - 91522 Ansbach - Germany
- phone: +49 (0) 981 / 69 21 - fax: +49 (0) 981 / 6 55 21 - info@reelcompany.com | Imprint